Maximum machining diameter 600mm/800mm SiC, quartz, ceramic grinding equipment XG series

Dean Machine Tool Co., Ltd. has introduced the XG600 upgraded product and XG800, which adopt the grinding spindle with the maximum speed of 5000r/min and are suitable for processing quartz and ceramic materials. This is the grinding equipment for SiC, ceramic and quartz parts required for the production of semiconductor wafers, which can greatly reduce the defective rate of processing procedures for high-purity and heat-resistant materials with high unit price of parts, and achieve strong and stable processing performance.

XG adopts a hard rail with excellent vibration absorption capacity and a stable X-axis support structure, which is suitable for grinding processes that are very sensitive to vibration and have high X-axis load. In addition, embedded grinding spindle is equipped as standard, which can realize high-quality machining, and 7.5kW high power option can be selected for machining high hardness materials such as SiC. In order to sense the speed and operate when the grinding spindle rotates, it is equipped with a speed that can distinguish different stages and can confirm the function of the current stage.

The precision reaches the industry's highest error range of -0.01mm~+0.01mm. The vibration is reduced and the thermal deformation is minimized through the integrated high stiffness Bed structure and the feed shaft guide rail that further improves the stability.

In particular, the sludge (quartz dust) treatment is simple, which increases the durability of the equipment. The chip remover and the cover at the gap of the equipment are of a fitting structure, which can block the penetration of quartz powder. A straight cutting fluid tank is used to facilitate the sludge removal. The cutting fluid tank can be disassembled from the front or rear of Bed, which can effectively use space.

In addition, in order to improve the user's convenience, the open space of the equipment door is reserved to provide enough internal operation area, so that the operation is more convenient when changing materials and tools. The C-axis control function is also added, which can realize the hole grinding processing that originally needed to be performed by a separate milling machine on one equipment.

If you need to consult and understand the grinding of quartz and ceramic parts required for the production of semiconductor wafers, and the XG 600/800 equipment of Dean Machine Tool that can provide strong and stable processing performance, please call Dean Machine Tool's national dealers.